News Release
May 17, 2011
NEW MiniSKiiP® PIM MODULES WITH MITSUBISHI IGBTs
-- Extention of MiniSKiiP® PIM modules with Mitsubishi Gen. 6 IGBT technology.--
Unterhaching/Germany, May 17, 2011 – Vincotech, a supplier of module-based solutions for power electronics, today announced that it will add the latest Mitsubishi IGBT technology to its range of MiniSKiiP® PIM modules. The new modules feature Mitsubishi Generation 6 chips ranging from 15A, 1200 V to 100A, 1200V. They come in three different housings.
Featuring the latest Mitsubishi Generation 6 IGBT chip technology, the new MiniSKiiP® PIM modules are available in three sizes for motor drive applications ranging up to 30kW:
- MiniSKiiP® size 1 (42 by 40 mm²) for 15A, 1200V
- MiniSKiiP® size 2 (59 by 52 mm²) for 25A, 1200V to 35A, 1200V
- MiniSKiiP® size 3 (82 by 59 mm²) for 50A, 1200 V to 100A, 1200V
All modules feature a 3-phase input rectifier, a 3-phase output inverter, a brake chopper, and an added thermistor to measure temperatures (PIM topology). Pins match the previous version’s array to enable easy upgrading. The modules will also be offered with pre-applied thermal grease. Samples are in the works for September 2011, with serial production slate for Q1 2012.
Vincotech is a registered trademark.
MiniSKiiP® is a registered trademark of Semikron.
Contacts:
Media Contact:
Karina Seifert
Phone: +49 (0)89 878067-115
karina.seifert@vincotech.com
Product Contact:
Werner Obermaier
Phone: +49 (0)89 878067-143
wobermaier@vincotech.com