Thermal Interface Material for Power Modules

Pre-Applied Thermal Interface Material (TIM)

Vincotech also offers pre-applied thermal conducting material. The benefits of using phase-change material for thermal conducting between the power module and heat sink are considerable. This material is solid at room temperature. This makes it smear-resistant during transportation and when assembling the power module. The screen-printing process is very accurate, so the material’s thickness is well defined and can be optimized for maximum heat transfer capability.

Features:

• Faster and easier assembly of the power module
• Thermal interface material (TIM) with optimized thickness
• Better R_th and reduced risk of DCB cracking
• Easier production process; no need for screen printing facilities
• Automated screen printing for utmost precision and reliability
• No risk of smearing the thermal paste; material is solid at room temperature
• Standard solder profile applicable (e.g. J-STD-001, J-STD-003)

Properties: