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Articles / Application Notes

MiniSKiiP® with a Si3N4 AMB Substrate >>

Embedded Designs Drive Tomorrow’s Solutions >>

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Thermal Measurement with an Integrated NTC Thermistor >>

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NEWS

MiniSKiiP®PACK 2 & 3: the new sixpack topology with extended power range


fastPACK 0 HC: the bidirectional fast-track to full current capability.


VINco E3: Vincotech’s new low-profile package for motion control, solar and UPS applications.


MiniSKiip®DUAL modules: MiniSKiip® meets Half-Bridge.


flowPACK 1 H6.5: Vincotech’s new three-level topology for solar applications

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