Application Notes & Reference Designs
Module Mechanics and Packaging
Document | Type | Date |
|---|---|---|
Application Note | 07/2012 | |
Advantages of Vincotech's Power Modules with Press-fit Technology | Application Note | 04/2012 |
Isolation Test of the Temperature Sensor in the P8X, P18X, P48X Modules | Application Note | 05/2005 |
Application Note | 09/2004 | |
Mechanic Interaction of Module, PCB and Heat Sink in Power Applications | Application Note | 10/2004 |