MiniSkiiP® Options
Lid
Two different lids are available for all MiniSKiiP® power modules, which are suitable for various designs:
Standard version:
- 6.5mm high
- Possibility of mounting SMD parts below the lid
Thin version:
- Just 2.8mm high
- For very compact mechanical designs
Thermal Paste
Vincotech offers MiniSKiiP® modules with pre-applied thermal paste.
Features:
- Faster and easier assembly of the module
- Thermal conducting material with optimized thickness
- Lower thermal resistance and reduced risk of DCB cracking
- Easier production process; no need for screen printing facilities
- Automated screen printing for utmost precision and reliability
- Standard solder profile applicable (e.g. J-STD-001, J-STD-003)
Properties:
Material | Wacker P12 |
|---|---|
Thermal conductivity | 1 W/m*K |
Order option codes for MiniSKiip® are:
Option Code | Lid | Thermal Paste P12 |
|---|---|---|
/0A/ | Standard (6.5mm) | – |
/1A/ | Standard (6.5mm) | Applied |
/0B/ | Thin (2.8mm) | – |
/1B/ | Thin (2.8mm) | Applied |
*MiniSKiiP® is a registered trademark of Semikron.
