September 29, 2010
Unterhaching/Germany, September 29, 2010 – Vincotech has extended its range of MiniSKiiP® PACK power modules with IGBT4 versions covering 8A to 150A for 1200V in three different housings. Designed for solderless assembly, Vincotech's MiniSKiiP® PACK power modules are an excellent first choice for your application or a perfect second source for Semikron’s product range.
Vincotech's new MiniSKiiP® PACK power modules use the latest Infineon IGBT4 chip technology to improve EMC. These power modules are available in three sizes targetting motor drive applications with up to 40 kW as well as power generation and UPS installations.
These MiniSKiiP® PACK power modules incorporate a 3-phase output inverter (SixPack topology) and an additional thermistor for temperature measurement. All Vincotech MiniSKiiP® PACK products are also available on demand with pre-applied thermal grease for easy use and a perfect junction to the heat sink, as well as with lids in two different heights.
Vincotech's MiniSKiiP® PACK power modules are pin-compatible with the previous versions of modules to enable quick upgrading. They are also fully compatible with their Semikron equivalents. Vincotech’s homepage provides cross-references, as well as data sheet and application note downloads.
MiniSKiiP® PACK modules are in series production and samples can be ordered via the standard sales channels. Please also see further information on Vincotech’s MiniSKiiP® PACK modules or Vincotech's general power module range.
Vincotech is a registered trademark of Vincotech Holding S.a.r.l.
MiniSKiiP® is a registered trademark of Semikron.
Phone: +49 (0)89 878067-115
Phone: +49 (0)89 878067-151