News Release
May 08, 2012
NEW MiniSKiiP® 3 PACK POWER MODULES
WITH MITSUBISHI IGBTS
-- Vincotech extends its range of MiniSKiiP® 3 PACK modules with Mitsubishi Gen. 6 IGBT technology. --
Unterhaching (Germany), May 8, 2012 – Vincotech, a supplier of module-based solutions for power electronics, today announced that it will add the latest Mitsubishi IGBT technology to its line of MiniSKiiP® 3 PACK modules. The new modules are equipped with Mitsubishi Generation 6 chips ranging from 75 A, 1200 V to 150 A, 1200 V.
Featuring the latest Mitsubishi Generation 6 IGBT chip technology, the new MiniSKiiP® 3 PACK modules are available for motor drive applications rated up to 45 kW:
- MiniSKiiP® size 3 (82 by 59 mm²) for 75 A, 1200 V to 150 A, 1200 V
All modules come with a 3-phase output inverter and an added thermistor to measure temperatures (PACK topology). Pins match the previous version’s array to enable easy upgrading. The modules will also be offered with pre-applied thermal grease. Samples are in the works for Jun 2012, with serial production slated for Q4 2012.
Vincotech is a registered trademark of Vincotech Holding S.a.r.l.
MiniSKiiP® is a registered trademark of Semikron.
Contacts:
Media Contact:
Karina Seifert
Phone: +49 (0)89 878067-115
karina.seifert@vincotech.com
Product Contact:
Koichi Tsurusako
Phone: +49 (0)89 8780 67-155
koichi.tsurusako@vincotech.com