February 16, 2011
Unterhaching/Germany, February 16, 2011 – Vincotech, a supplier of module-based solutions for power electronics, has released Press-fit versions of its flowPIM® power modules. Enabling very easy and reliable mounting of power modules on PCBs, the Press-fit modules have the same footprint as Vincotech’s standard solder pin versions. Soldering is no longer necessary, since the power modules with Press-fit technology are mechanically
Vincotech’s standard flowPIM®0, flowPIM®1, and flowPIM®2 power modules feature a 3-phase input rectifier, 3-phase output inverter, brake chopper and supplementary thermistor for temperature sensing (Power Integrated Modules topology). These modules are now available with Press-fit pins, providing the same features as the standard-pin versions. Vincotech’s new Press-fit technology drastically reduces PCB assembly time, effort and cost. This technology enables very easy and reliable mounting of power modules on PCBs, eliminating the need for soldering because the power modules are mechanically pressed in. The footprint is pin compatible with the solder-pin versions, so the same board layout can be used when standard soldered modules are replaced by Press-fit modules.
The flowPIM® power modules with Press-fit technology are the ideal solution for standard motor drives, servo drives and application integrated drives. These power modules are in series production; samples can be ordered via the standard sales channels.
To learn more about Vincotech’s general power modules range, please go to products.
Vincotech is a registered trademark of Vincotech Holding S.a.r.l.
flowPIM® is a registered trademark of Vincotech Holding S.a.r.l.
Phone: +49 (0)89 878067-115
Phone: +49 (0)89 878067-145