Our Technology - Your Application
Applications design, layout and testing options
- Design and layout service
- Mechanical design
- Standard as well as specialized measurement technology
Assembly Technologies
- Standard SMT, as well as BGA, µBGA and CSP, also with a lead-free technology
- Leadframe assembly SMT or THT in SIL or DIL variants
- Dip coating, i.e. encapsulation in casing
Substrate
- Standard and multilayer thick film on ceramic with printed, laser-tuned resistances
- Standard FR-4/FR-5 printed circuit boards, CEM, Starr-Flex
- Multilayer printed circuit boards for very high wire densities
- DCB and IMS
